Solidot concluded the 2026 Chengdu International Industrial Exposition with a perfect finish

From March 11 to 13, the 2026 Chengdu International Industrial Fair (hereinafter referred to as "Chengdu Industrial Fair"), themed "Creating New Industrial Chains, Co-building a New Carbon Future," was grandly held at the Western China International Expo City in Chengdu. Solidot made a major appearance with its Slice, discrete, and IO-Link bus I/O solutions.

Industry Highland, Jointly Drawing a New Blueprint for Western Intelligent Manufacturing

Solidot is well aware that the western region holds an important position in national strategy. This exhibition was not only a showcase of cutting-edge products, but also aimed to build an efficient bridge for exchange and drive the regional application of advanced automation solutions. Through in-depth on-site exchanges with nearly a hundred customers and partners from industries such as automotive manufacturing, new energy, chemicals, and logistics, new paths for automation transformation were jointly explored.

Highlights Abound, Creating a Brand-New bus I/O Solution

At this exhibition, Solidot focused on showcasing product lines such as high-reliability Slice I/O, wiring-saving discrete I/O, and IO-Link bus I/O, targeting the pain points in the current bus I/O field regarding performance reliability and wiring economy.

The high-reliability Slice I/O module XB6S series products are compatible with various bus protocols and feature function modules such as motion control and temperature acquisition. The products have undergone strict EMC testing, offering superior immunity to interference and eliminating disconnections; they support diagnostics, alarms, and exception log recording, providing intelligent feedback and ease of use.

The discrete I/O module XBF series products use standard industrial Ethernet cables for connection, avoiding the procurement of special cables and tools and effectively reducing wiring costs; they come in product lines with different form factors and protection ratings, capable of adapting to various complex industrial application scenarios; expansion modules do not occupy bus protocol node resources, effectively improving system scalability and resource utilization; they support various topology types such as daisy chain, star, and hybrid, making system layout more flexible.

The Solidot IO-Link bus I/O module is designed in accordance with the IO-Link v1.1.3 specification, integrating power supply and data transmission, significantly simplifying the wiring process and improving deployment efficiency. It supports various mainstream bus protocols such as EtherCAT and PROFINET, and features plug-in connections and intelligent diagnostics. It is currently widely used in industrial scenarios such as automotive manufacturing and logistics, enabling rapid device connection, efficient data transmission, and intelligent system management, thereby improving production efficiency.

At this exhibition, Solidot gained a great deal from the showcases and exchanges. In the future, Solidot will continue to deepen its presence in the industrial bus I/O field, unleash the potential of technological innovation, strengthen its R&D foundation, and fully promote the leapfrog development of intelligent manufacturing bus I/O products.