Solidot Made a Splendid Appearance at the 2025 Chengdu International Industrial Expo

On April 23, the 2025 Chengdu International Industry Fair (hereinafter referred to as the "Fair") officially opened, and Solidot made a brilliant appearance with its independently developed innovative products. During the Fair, Solidot attracted numerous professional visitors, company representatives and industry experts with its in-depth presentation of cutting-edge bus I/O technology. On-site staff provided professional explanations covering technical principles, application scenarios and actual performance, offering visitors a panoramic interpretation of bus I/O technology.

figure: Solidot booth at the Fair

Deep commitment to technological innovation, creating a new model for domestic I/O innovation and development

High-reliability Slice I/O module XB6S series products

The Slice I/O module XB6S series products support multiple bus protocols and feature function modules for motion control and temperature acquisition. The products have passed strict EMC testing, offering strong immunity against interference and eliminating disconnections; they support diagnostics, alarms and exception log recording for intelligent feedback and convenient use.

Reduced-wiring discrete I/O module XBF series products

The discrete I/O module XBF series products use standard industrial Ethernet cables, avoiding the need to purchase special cables and tools and effectively reducing wiring costs; the product lineup includes various form factors and Protection ratings to suit complex industrial application scenarios; expansion modules do not occupy bus protocol node resources, effectively improving system scalability and resource utilization; they support serial, star, hybrid and other topology types for greater system layout flexibility.

Fieldbus Valve terminal series products

Solidot's Fieldbus Valve terminal series products offer high versatility, seamlessly compatible with Solenoid valves from mainstream brands and supporting multiple bus protocols. The Manifold is made of aluminum alloy, enhancing mechanical performance while meeting the needs of diverse industrial application scenarios.

Focusing on industry enablement, painting a new picture of intelligent upgrades across multiple sectors

Solidot's bus I/O products help companies complete intelligent upgrades of production equipment and are now widely used in 3C electronics, automotive manufacturing, new energy, logistics and warehousing and many other industries. During the Fair, Solidot's sales team identified customer needs in depth and, combined with industry application scenarios, customized and presented multiple professional solutions on site.

In the future, Solidot will continue to deepen its commitment to bus I/O technology, guided by market demand and driven by technological breakthroughs, constantly pushing performance boundaries and exploring new bus I/O application scenarios to provide more efficient and more intelligent bus I/O solutions for the industrial automation field.