sDot

"Meeting in Xiang": Solidot Participates in the Industrial Control Network Digital Seminar (Changsha Station)

2022-11-22

On November 17, the digital Roadshow conference of the industrial control network arrived in Changsha, where several seasoned experts in intelligent manufacturing shared their insights on-site. Based on the current state of manufacturing development in Changsha, they engaged in in-depth discussions on the critical issue of how cutting-edge technologies enable new developments, new practices, and new directions for advanced manufacturing in the digital era.


Solidot, as a representative of domestic I/O enterprises, was invited to attend and brought digital products and solutions centered on industrial fieldbus and innovative interconnection to Changsha customers.



Mr. Chen Xiaobo, Marketing Director of Solidot, focused on introducing Solidot's three major product lines: integrated I/O, Slice I/O, and Fieldbus Valve terminal.



Among them, the XX4 Series integrated I/O is the most compact remote I/O in the industry, measuring only 1/2 to 1/5 the size of comparable products; the XB6 Slice I/O uses the self-developed X-bus backplane bus, supporting expansion to up to 32 I/O modules and 1024 I/O points with a scan cycle of <= 1 ms, and features a split upper/lower wiring layout that effectively reduces wiring strain.


The integrated Valve terminal features a custom Manifold and full aluminum alloy design, supporting up to 24 positions of single Solenoid control and 12 positions of Double Solenoid control; the Slice Valve terminal can be used in combination with Solidot's XB6 Series Slice I/O, supporting up to 16 Solenoid valves (including single/double solenoid control).

In the subsequent product case study presentation, Mr. Chen Xiaobo demonstrated to Changsha customers on-site the applications of Solidot I/O products across different communication protocols and industrial interconnection scenarios, including the application of CC-Link integrated I/O in the LCD industry, EtherCAT Slice I/O in the 3C industry, and PROFINET Slice I/O in the lithium battery industry. With excellent quality assurance and reliable technical features, Solidot remote I/O has resolved, one by one, the pain points customers faced in their original solutions across various on-site applications.



Next, Mr. Chen Xiaobo also gave a detailed introduction to Solidot's upcoming new products, including the EC7 Series bus I/O with IP67 protection rating, IO-Link I/O, and the new Fieldbus Valve terminal.


The EC7 Series bus I/O housing is made of PBT + GF30% reinforced plastic material with an IP67 protection rating. The power connector adopts M12-L coding and supports a maximum overcurrent of 16 A. The rich Indicator LED function design makes module status visible at a glance.


The IO-Link I/O is designed to the IO-Link v1.1 specification, with interface type selectable as class-A or class-B, and can connect various IO-Link standard devices and standard digital signal inputs. LED status Indication, channel-level protection and diagnostics, and IP67 protection rating are all product highlights.


Mr. Chen Xiaobo stated that the excellent quality of Solidot products is inseparable from the strict control behind product R&D, testing, materials, production, suppliers, and after-sales maintenance. In the future, Solidot will continue to focus on industrial interconnection scenarios and launch more remote discrete I/O products to empower enterprises in their digital and intelligent transformation.