Solidot Technology Featured at CC-Link Protocol Family Compatible Products Seminar, Delivers Keynote Address

On August 30, the CC-Link Protocol Family Compatible Products Seminar was successfully convened at the Yangtze River International Hotel in Shanghai Hongqiao. As the exclusive I/O product representative, Solidot Technology was invited to present a keynote speech, underscoring its leadership in industrial automation solutions.

      The seminar brought together sales and technical teams from Mitsubishi Electric’s East China division, authorized distributors, and leading compatible product manufacturers. Attendees engaged in forward-looking discussions on industry trends and collaborative opportunities.

   Mr. Yu Qingcheng, Sales Manager of Solidot Technology, delivered a comprehensive presentation on the company’s CC-Link protocol-compatible product portfolio, including:

· CC-Link

· CC-Link IE Field Basic

· CC-Link IE TSN

Leveraging years of expertise, Solidot showcased its advanced I/O solutions and shared real-world application cases across diverse industries, demonstrating how these protocols enhance automation efficiency and connectivity.

    The event concluded with a commemorative group photo featuring Mr. Xia Hongyu (Front Row, 5th from left), Founder and CEO of Solidot Technology, alongside representatives from CLPA (CC-Link Partner Association) and Mitsubishi Electric.

      A Vision for the Future
Solidot Technology reaffirmed its commitment to collaborating with CLPA to expand the CC-Link protocol family’s ecosystem. By developing innovative compatible products, the company aims to simplify industrial intelligence and drive the evolution of smart manufacturing.

Looking Ahead
“We are honored to contribute to the CC-Link ecosystem,” stated Mr. Xia Hongyu. “Together with CLPA and industry partners, Solidot will continue to deliver cutting-edge solutions that empower seamless industrial connectivity and operational excellence.”

Solidot Technology: Pioneering Automation, Enabling Smarter Industry.